Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
Edition 2015-12

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
Edition 2012-03

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011); German version EN 60749-7:2011
Edition 2012-02

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
Edition 2011-06

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010
Edition 2011-05

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011
Edition 2011-07

Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006
Edition 2007-02

Liquid crystal display devices - Part 3-1: Liquid crystal display (LCD) cells - Blank detail specification (IEC 61747-3-1:2006); German version EN 61747-3-1:2006
Edition 2007-05

Liquid crystal display devices - Part 2-2: Matrix colour LCD modules - Blank detail specification (IEC 61747-2-2:2004); German version EN 61747-2-2:2004
Edition 2005-05

Plasma display panels - Part 3-1: Mechanical interface (IEC 61988-3-1:2005); German version EN 61988-3-1:2005
Edition 2006-05