Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
Edition 2012-03

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020
Edition 2023-07

Products and systems for the protection and repair of concrete structures - Definitions, requirements, quality control and evaluation of conformity - Part 10: Site application of products and systems and quality control of the works; German version EN 1504-10:2017
Edition 2017-12

Investigation and assessment of drain and sewer systems outside buildings - Part 2: Visual inspection coding system; German version EN 13508-2:2003+A1:2011
Edition 2011-08

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006
Edition 2007-05

Industrial-process measurement and control - Data structures and elements in process equipment catalogues - Part 16: Lists of properties (LOPs) for density measuring equipment for electronic data exchange (IEC 61987-16:2016); German version EN 61987-16:2017
Edition 2018-07

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements; flatness considerations for electronic assemblies (IEC 61188-1-1:1997); German version EN 61188-1-1:1997
Edition 1998-03

Fine ceramics (advanced ceramics, advanced technical ceramics) - Reinforcement of ceramic composites - Determination of distribution of tensile strength and tensile strain to failure of filaments within a multifilament tow at ambient temperature (ISO/FDIS 22459:2024); German and English version prEN ISO 22459:2024
Edition 2024-04

Paints, varnishes and coatings - Corrosion protection of supporting thin-walled building components made of steel - Part 1: Requirements and test methods
Edition 2024-07

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
Edition 2015-11