Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
Edition 2011-06

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010
Edition 2011-05

A specification in the IEC quality assessment system for electronic components (IECQ) - Quartz crystal units - Part 3: Sectional specification, qualification approval; section 1: Blank detail specification; identical with IEC 61178-3-1:1993
Edition 1995-02

Small fire extinguishing systems - Requirements, testing
Edition 2022-08

Corrosion of metals and alloys - Comparative account of accelerated corrosion test methods and of their suitability for different fields of application and corrosion protection systems
Edition 2023-08

Fluorescent ultraviolet lamps used for tanning - Measurement and specification method (IEC 61228:2020); German version EN IEC 61228:2020
Edition 2021-05

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
Edition 2015-12

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

Telecontrol equipment and systems - Part 2: Operating conditions; Section 2: Environmental conditions (climatic, mechanical and other non-electrical influences) (IEC 60870-2-2:1996); German version EN 60870-2-2:1996
Edition 1998-06

Glass in Building - Design and construction rules - Part 3: Point fixed glazing
Edition 2023-11