Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Edition 2004-02-19

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications - Rectangular connectors - Detail specification for single row connectors with non-removable ribbon cable contacts on 1,25 mm pitch used for high speed serial data (HSSDC)
Edition 2004-02-26

Materials for printed boards and other interconnecting structures - Part 2-11 : reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Edition 2004-04-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Subracks and associated plug-in units
Edition 2005-01-18

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications. Sectional specification. Printed board connectors
Edition 1997-03-15

Modular order for the development of mechanical structures for electronic equipment practices. Sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice. Detail specification. Dimensions for subracks, chassis, backplanes, front panels and plug-in units
Edition 1997-04-15

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications. Printed board connectors. Blank detail specification
Edition 1997-05-15

Packaging of winding wires. Containers for round winding wires
Edition 1992-08-15

EMC IC modelling. Models of integrated circuits for RF immunity behavioural simulation. Conducted immunity modelling (ICIM-CI)
Edition 2016-11-30

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads (Endorsed by Asociación Española de Normalización in June of 2021.)
Edition 2021-06-01