Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of chassis for embedded computing devices
Edition 2016-03-31

Semiconductor devices. Micro-electromechanical devices. Terms and definitions
Edition 2016-04-30

Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of R-type subracks and plug-in units
Edition 2015-01-31

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices
Edition 2015-02-28

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2013-04-30

Connectors for electronic equipment. Product requirements. Printed board connectors. Detail specification for a high-speed two-part connector with integrated shielding function
Edition 2012-07-31

Plasma display panels. Measuring methods. Acoustic noise
Edition 2012-09-30

Connectors for electronic equipment. Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 500 MHz
Edition 2010-06-30

Connectors for electronic equipment. Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 500 MHz
Edition 2010-06-30

Connectors for electronic equipment. Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz
Edition 2010-08-31