Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Edition 2010-10

Heat-shrinkable moulded shapes - Part 3: Specification requirements for shape dimensions, material requirements and compatibility performance - Sheet 102: Heat-shrinkable elastomeric moulded shapes, semi-rigid, material requirements and system performance
Edition 2010-09

Railway applications - Railway rolling stock power and control cables having special fire performance. Part 3-1: Cables with crosslinked elastomeric insulation with reduced dimensions - Single core cables
Edition 2008-06

Railway applications - Railway rolling stock power and control cables having special fire performance - Part 3-2: Cables with crosslinked elastomeric insulation with reduced dimensions - Multicore cables
Edition 2008-06

Cold rolled uncoated and zinc or zinc-nickel electrolytically coated low carbon and high yield strength steel flat products for cold forming - Tolerances on dimensions and shape
Edition 2006-10

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series. Part 3-101: Subracks and associated plug-in units
Edition 2004-09

Mechanical standardization of semiconductor devices. Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Edition 2003-12

Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Edition 2003-07

Connectors for frequencies below 3 MHz for use with printed boards. Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Edition 1998-01

Electrodeposited nickel coatings on magnetic and non-magnetic substrates - Measurement of coating thickness - Magnetic method (ISO 2361:1982)
Edition 1995