Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020
Edition 2023-02

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-4: Tests - Fibre or cable retention (IEC 61300-2-4:2019 + A1:2020); German version EN IEC 61300-2-4:2019 + A1:2020
Edition 2022-09

Products and systems for the protection and repair of concrete structures - Test methods - Part 4: Determination of shrinkage and expansion; German version EN 12617-4:2002
Edition 2002-08

Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) (IEC 62373:2006); German version EN 62373:2006
Edition 2007-01

All-or-nothing electrical relays - Tests and Measurements - Part 7-49: Long term stability of sealing (IEC 94/582/CD:2021); Text in German and English
Edition 2022-08

All-or-nothing electrical relays - Tests and Measurements - Part 7-44: Salt mist (IEC 94/560/CD:2021); Text in German and English
Edition 2022-10

Blank detail specification - Fixed capacitors for direct current with electrodes of thin metal foils and a polycarbonate film dielectric - Assessment level EZ; German version EN 131702:1997
Edition 1998-11

Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval); German version EN 153000:1998
Edition 1999-01

Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 (IEC 40/3056/CDV:2023); German and English version prEN IEC 60384-22:2023
Edition 2024-02

Aerospace series - Elements of electrical and optical connection - Test methods - Part 315: Fluid resistance; German and English version EN 2591-315:2015
Edition 2016-01