Industrial communication networks - Profiles - Part 1-X: Fieldbus profiles (IEC 65C/1035/CD:2020); Text in English
Edition 2021-05

Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Fixed power resistors (IEC 40/2693/CD:2019); Text in German and English
Edition 2020-04

Ultrasonics - Hydrophones - Part 1: Measurement and characterization of medical ultrasonic fields up to 40 MHz (IEC 87/747/CD:2020);Text in German and English
Edition 2022-04

Solderless connections - Part 2: Crimped connections - General requirements, test methods and practical guidance (IEC 48B/2889/CD:2021); Text in German and English
Edition 2023-03

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018
Edition 2018-10

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
Edition 2015-12

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
Edition 2012-03

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010
Edition 2011-05

Liquid crystal display devices - Part 3-1: Liquid crystal display (LCD) cells - Blank detail specification (IEC 61747-3-1:2006); German version EN 61747-3-1:2006
Edition 2007-05

Liquid crystal display devices - Part 2-2: Matrix colour LCD modules - Blank detail specification (IEC 61747-2-2:2004); German version EN 61747-2-2:2004
Edition 2005-05