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DIN EN 61163-1
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots (IEC 61163-1:2006); German version EN 61163-1:2006
Edition
2007-06
DIN EN ISO 19893
Plastics piping systems - Thermoplastics pipes and fittings for hot and cold water - Test method for the resistance of mounted assemblies to temperature cycling (ISO 19893:2011); German version EN ISO 19893:2018
Edition
2018-12
DIN EN 61191-4
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
Edition
2018-05
DIN EN 61189-5-1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
Edition
2017-04
DIN EN IEC 61189-2-801
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
Edition
2019-04
DIN 69001-16
Machine tools; Multi-spindle heads; Assemblies, Spindle drives, Types A to F
Edition
1981-10
DIN EN 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
Edition
2018-05
DIN EN IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1546/CD:2018); Text in German and English
Edition
2019-05
DIN EN IEC 61189-2-803
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018); Text in German and English
Edition
2019-05
DIN EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
Edition
2022-03
