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DIN EN 60512-23-4
Connectors for electronic equipment - Tests and measurements - Part 23-4: Screening and filtering tests; Test 23d: Transmission line reflections in the time domain (IEC 60512-23-4:2001); German version EN 60512-23-4:2001
Edition
2002-07
DIN EN IEC 61191-1
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
Edition
2019-06
DIN EN 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
Edition
2018-05
DIN EN 61188-5-8
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition
2008-07
DIN EN 60512-25-7
Connectors for electronic equipment - Tests and measurements - Part 25-7: Test 25g - Impedance, reflection coefficient and standing voltage wave ratio (VSWR) (IEC 60512-25-7:2004); German version EN 60512-25-7:2005
Edition
2005-12
DIN EN 62326-20
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
Edition
2016-12
DIN 50023
Corrosion of metals and alloys - Electrochemical test methods - Test method for the determination of surface resistivity of zinc and zinc coatings using gel electrolytes
Edition
2024-07
DIN EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition
2022-08
DIN EN 60821
IEC-821-VMEbus - Microprocessor system bus for 1 byte to 4 byte data (IEC 60821:1991, modified); German version EN 60821:1994
Edition
1994-09
DIN EN 60191-4
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition
2019-02
