Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005); German version EN 61967-2:2005
Edition 2006-03

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
Edition 2019-06

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition 2022-04

Printed boards - Part 1: Generic specification (IEC 62326-1:2002); German version EN 62326-1:2002
Edition 2002-12

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
Edition 2021-10

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition 2022-08

Corrosion of metals and alloys - Electrochemical test methods - Test method for the determination of surface resistivity of zinc and zinc coatings using gel electrolytes
Edition 2024-07

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
Edition 2018-05

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2020); German version EN IEC 61760-1:2020
Edition 2022-12

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02