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IPC 9502
PWB Assembly Soldering Process Guideline for Electronic Components
Edition
1999-04-01
IPC 9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Edition
2010-12-14
IPC AJ-820A
Assembly & Joining Handbook
Edition
2012-02-21
IPC D-355
Printed Board Automated Assembly Description in Digital Form
Edition
1995-01-01
IPC EIA/JEDEC J-STD-075A ; ECIA/IPC/JEDEC J-STD-075A:2018-05-01
Classification of Passive and Solid State Devices for Assembly Processes
Edition
2018-05-01
IPC FA-251
Guidelines for Assembly of Single-Sided and Double-Sided Flex Circuits
Edition
1992-02
IPC FC-234A
Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
Edition
2014-12-23
IPC HDBK-850
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
Edition
2012-07-31
IPC HDBK-4691
Handbook on Adhesive Bonding in Electronic Assembly Operations
Edition
2015-11-01
IPC HERMES-9852
The Global Standard for Machine-to-Machine Communication in SMT Assembly; Version 1.5
Edition
2022-11-01