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Standards [CURRENT]

DIN EN 12470-2

Clinical thermometers - Part 2: Phase change type (dot matrix) thermometers; German version EN 12470-2:2000+A1:2009
Edition 2009-11

Standards [CURRENT]

DIN EN 61747-6-3

Liquid crystal display devices - Part 6-3: Measuring methods for liquid crystal display modules - Motion artifact measurement of active matrix liquid crystal display modules (IEC 61747-6-3:2011); German version EN 61747-6-3:2011
Edition 2012-05

Standards [CURRENT]

DIN ISO 18084

Press tools for tablets - Punches and dies (ISO 18084:2011)
Edition 2012-08

Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb₃Sn composite superconducting wires (IEC 61788-12:2013); German version EN 61788-12:2013
Edition 2014-04

Standards [CURRENT]

DIN EN ISO 22036

Environmental solid matrices - Determination of elements using inductively coupled plasma optical emission spectrometry (ICP-OES) (ISO 22036:2024); German version EN ISO 22036:2024
Edition 2024-04

Standards [CURRENT]

DIN EN ISO 22818

Textiles - Determination of short-chain chlorinated paraffins (SCCP) and middle-chain chlorinated paraffins (MCCP) in textile products out of different matrices by use of gas chromatography negative ion chemical ionization mass spectrometry (GC-NCI-MS) (ISO 22818:2021); German version EN ISO 22818:2021
Edition 2021-06

Standards [CURRENT]

CSA ISO/IEC 21471

Information technology - Automatic identification and data capture techniques - Extended rectangular data matrix (DMRE) bar code symbology specification (Adopted ISO/IEC 21471:2020, first edition, 2020-02)
Edition 2020-11-01

Technical rule [CURRENT]

AGI Z 13 TIB

Brandfallmatrix
Edition 2017-04

Standards [CURRENT]

DIN EN 62137-4

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
Edition 2015-07

Standards [CURRENT]

DIN EN 61188-5-8

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition 2008-07

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