Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1878/CDV) (english version)
Edition 2023-10-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Edition 2016-04-30

BS EN 61188-6-3 Ed.1.0. Circuit boards and circuit board assemblies. Design and use. Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)
Edition 2021-01-06

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
Edition 2016-05-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Edition 2016-11-05

Lathe chucks, without through-hole; technical conditions of delivery for power operated lathe chucks
Edition 1983-01

TP-96A Plated Through Hole Integrity Test Procedure for Electrical Connectors
Edition 2017-06-19

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Edition 2018-05

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition 2022-04

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021
Edition 2022-07