Search results
Search list
Results in:
OVE EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1878/CDV) (english version)
Edition
2023-10-01
BS EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Edition
2016-04-30
21/30431274 DC
BS EN 61188-6-3 Ed.1.0. Circuit boards and circuit board assemblies. Design and use. Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)
Edition
2021-01-06
UNE-EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
Edition
2016-05-01
NF C93-733-719 ; NF EN 61189-3-719:2016-11-05
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Edition
2016-11-05
DIN 6386-2
Lathe chucks, without through-hole; technical conditions of delivery for power operated lathe chucks
Edition
1983-01
EIA-364-96A
TP-96A Plated Through Hole Integrity Test Procedure for Electrical Connectors
Edition
2017-06-19
DIN EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Edition
2018-05
DIN EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition
2022-04
DIN EN IEC 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021
Edition
2022-07