Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
Edition 2011-06

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
Edition 2019-06

Concept for the design of 3D models based on properties according to DIN 4000 - Part 1: Overview and fundamental principles
Edition 2017-10

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition 2022-08

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Edition 2018-05

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
Edition 2008-07

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
Edition 2002-07

Distribution automation using distribution line carrier systems - Part 4: Data communication protocols; Section 41: Application protocols; Distribution line message specification (IEC 61334-4-41:1996); German version EN 61334-4-41:1996
Edition 1997-09

Unfired pressure vessels - Part 3: Design; German version EN 13445-3:2021, only on CD-ROM
Edition 2021-12

Foodstuffs - Methods of analysis for the detection of genetically modified organisms and derived products - Qualitative nucleic acid based methods (ISO 21569:2005 + Amd 1:2013); German version EN ISO 21569:2005 + A1:2013
Edition 2013-08