Connectors for electronic equipment - Part 4-100 : printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes
Edition 2002-08-01

Materials for printed boards and other interconnecting structures - Part 2-21 : reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Edition 2004-04-01

Test methods for electrical materials, interconnection structures and assemblies - Part 6: test methods for materials used in manufacturing electronic assemblies
Edition 2008-05-01

Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Edition 2012-10-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107 : dimensions of subracks and plug-in units, small form factor
Edition 2012-09-01

Plasma Display Panels - Part 2-5 : Measuring methods - Acoustic noise
Edition 2012-11-01

Mechanical standardization of semiconductor devices - Part 6-16 : glossary of semiconductor test and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition 2013-01-05

Integrated circuits - Measurement of electromagnetic emissions - Part 8: measurement of radiated emissions - IC stripline method
Edition 2012-03-01

Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3 : sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
Edition 2013-11-16

EMC IC modelling - Part 1: general modelling framework
Edition 2019-04-26