Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition 2007-07-31

Quality assessment systems - Selection and use of sampling plans for inspection of electronic components and packages
Edition 2007-12-31

Railway rolling stock and fixed equipment. Fitting devices of electronic equipment, plug-in units, subracks, racks, cabinets. Dimensional characteristics
Edition 1994-12-01

Connectors for frequencies below 3 MHz for use with printed boards. Part 8: two-parts connectors for printed boards, for basic grid of 2,54 mm (0,1 in) with square male contacts of 0,63 mm X 0,63 mm
Edition 1998-07-01

Connectors for frequencies below 3 MHz for use with printed boards. Part 12: detail specification for dimensions, general requirements and tests for à range of socket designed for use with integrated circuits
Edition 1998-06-01

Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of subracks and plug-in units, small form factor
Edition 2012-04-30

Plasma display panels - Part 2-3 : measuring methods - Image quality : defects and degradation
Edition 2010-04-01

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Edition 2011-06-30

Connectors for frequencies below 3 MHz for use with printed boards. Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Edition 1998-05-15

Connectors for frequencies below 3 MHz for use with printed boards. Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in)
Edition 1998-05-15