Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
Edition 2013-06-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor (Endorsed by AENOR in June of 2012.)
Edition 2012-06-01

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)
Edition 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)
Edition 2014-02-01

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by Asociación Española de Normalización in May of 2018.)
Edition 2018-05-01

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by Asociación Española de Normalización in May of 2018.)
Edition 2018-05-01

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by Asociación Española de Normalización in May of 2018.)
Edition 2018-05-01

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 Series - Part 6: Air recirculation and bypass of indoor cabinets (Endorsed by Asociación Española de Normalización in June of 2020.)
Edition 2020-06-01

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (Endorsed by Asociación Española de Normalización in July of 2023.)
Edition 2023-07-01

Solderless connections - Part 6: insulation piercing connections - General requirements, test methods and practical guidance
Edition 2023-01-20