Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits. (Endorsed by AENOR in November of 2001.)
Edition 2001-11-01

Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors with shielding and a basic grid of 2,5 mm. (Endorsed by AENOR in November of 2001.)
Edition 2001-11-01

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007). (Endorsed by AENOR in October of 2007.)
Edition 2007-10-01

Aerospace series - Cables, optical, single core 200 µm/280 µm fibre, 2,5 mm outer jacket - Technical specification (Endorsed by AENOR in March of 2009.)
Edition 2009-03-01

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Edition 2009-06-01

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Edition 2009-06-01

Materials for interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability. (Endorsed by AENOR in September of 2008.)
Edition 2008-09-01

Plasma display panels - Part 2-5: Measuring methods - Acoustic noise (Endorsed by AENOR in October of 2012.)
Edition 2012-10-01

Plasma display panels - Part 2-3: Measuring methods - Image quality: defects and degradation (Endorsed by AENOR in March of 2010.)
Edition 2010-03-01

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (Endorsed by AENOR in September of 2011.)
Edition 2011-09-01