Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
Edition 2016-08-01

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
Edition 2016-08-01

MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES. PART 2: SECTIONAL SPECIFICATION. INTERFACE COORDINATION DIMENSIONS FOR THE 25 MM EQUIPMENT PRACTICE. (Endorsed by AENOR in December of 1995.)
Edition 1995-12-01

MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES. PART 2: SECTIONAL SPECIFICATION. INTERFACE CO-ORDINATION DIMENSIONS FOR THE 25 MM EQUIPMENT PRACTICE. SECTION 1: DETAIL SPECIFICATION. DIMENSIONS FOR CABINET AND RACKS. (Endorsed by AENOR in December of 1995.)
Edition 1995-12-01

Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1 (Endorsed by AENOR in November of 2002.)
Edition 2002-11-01

Connectors for electronic equipment - Part 4-110: Printed board connectors with assessed quality - Detail specification for latched cable connector system having a basic grid of 2,0 mm including full shielding and latching function (Endorsed by AENOR in November of 2002.)
Edition 2002-11-01

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in November of 2002.)
Edition 2002-11-01

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007). (Endorsed by AENOR in October of 2007.)
Edition 2007-10-01

Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes (Endorsed by AENOR in May of 2002.)
Edition 2002-05-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (Endorsed by AENOR in November of 2004.)
Edition 2004-11-01