Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval); German version EN 153000:1998
Edition 1999-01

Thermal analysis (TA) - Differential thermal analysis (DTA) and differential scanning calorimetry (DSC) - Part 1: General Principles
Edition 2024-08

Electroacoustics - Random-incidence and diffuse-field calibration of sound level meters (IEC 61183:1994); German version EN 61183:1994
Edition 1994-12

Determination of airborne noise emitted by machines by, measurement of structure borne noise; basic requirements
Edition 1985-06

Blank detail specification - Phototransistors, photodarlington transistors, phototransistor arrays; German version EN 120003:1992
Edition 1996-11

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling (IEC 62610-2:2018); German version EN IEC 62610-2:2018
Edition 2019-04

Dynamic modules - Part 3-3: Performance specification templates - Wavelength selective switches (IEC 62343-3-3:2020); German version EN IEC 62343-3-3:2020
Edition 2021-03

Determination of inrush current characteristics of lighting products (IEC 63129:2020); German version EN IEC 63129:2020
Edition 2021-05

Fibre optic interconnecting devices and passive components - Performance standard - Part 041-2: Non-connectorized single-mode OTDR reflecting device for category C - Controlled environment (IEC 61753-041-2:2014); German version EN 61753-041-2:2014
Edition 2015-02

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
Edition 2007-02