MICROPOCESSOR SYSTEM BUS I 8-BIT AND 16 BIT DATA. PART 3: MECHANICAL AND PIN DESCRIPTIONS FOR THE EUROCARD CONFIGURATION WITH PIN AND SOCKET (INDIRECT) CONNECTORS.
Edition 1994-09-23

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
Edition 1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
Edition 1996-10-23

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
Edition 1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
Edition 1996-10-16

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
Edition 1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
Edition 1996-10-14

MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES. PART 2: SECTIONAL SPECIFICATION. INTERFACE CO-ORDINATION DIMENSIONS FOR THE 25 MM EQUIPMENT PRACTICE. SECTION 2: DETAIL SPECIFICATION. DIMENSIONS FOR SUBRACKS, CHASSIS, BACKPLANES, FRONT PANELS AND PLUG-IN UNITS.
Edition 1997-09-19

Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards, for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm x 0,63 mm.
Edition 2001-09-21

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad.
Edition 2003-03-28