Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
Edition 2017-11

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Edition 2016-04

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Edition 2015-07

Device embedded substrate - Part 1-1: Generic specification - Test methods
Edition 2015-07

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Edition 2013-09

Materials for interconnection structures. Part 5: Sectional specification set for conductive foils and films with or without coatings. Section 4: Conductive inks
Edition 1996-08

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification (IEC 62326-4:1996)
Edition 1997-01

Low-voltage electrical installations - Part 8-1: Functional aspects - Energy efficiency
Edition 2019-06

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Edition 2021-08

Quantities and units - Part 9: Physical chemistry and molecular physics (ISO 80000-9:2019)
Edition 2020-06