Search results
Search list
Results in:
SN EN 60286-1
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
Edition
2017-11
SN EN 62047-26
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Edition
2016-04
SN EN 62047-17
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Edition
2015-07
SN EN 62878-1-1
Device embedded substrate - Part 1-1: Generic specification - Test methods
Edition
2015-07
SN EN 62047-18
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Edition
2013-09
SN EN 61249-5-4
Materials for interconnection structures. Part 5: Sectional specification set for conductive foils and films with or without coatings. Section 4: Conductive inks
Edition
1996-08
SN EN 62326-4
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification (IEC 62326-4:1996)
Edition
1997-01
SN HD 60364-8-1
Low-voltage electrical installations - Part 8-1: Functional aspects - Energy efficiency
Edition
2019-06
SN EN IEC 62878-2-602
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Edition
2021-08
SN EN ISO 80000-9
Quantities and units - Part 9: Physical chemistry and molecular physics (ISO 80000-9:2019)
Edition
2020-06