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ABNT NBR IEC 61189-2
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for interconnection structures
Edition
2011-06-07
ABNT NBR IEC 61189-3
Test methods for electrical materials, interconnections structures and assemblies Part 3: Test methods for interconnection structures (printed boards)
Edition
2012-07-04
BS EN 61967-5
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions - Workbench Faraday Cage method
Edition
2003-06-17
SN EN 14612
Space product assurance - Verification and approval of automatic machine wave soldering
Edition
2003-12
NF C83-401-809 ; NF EN 175101-809:2004-07-01
Detail specification : two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
Edition
2004-07-01
BS ISO 17331+A1
Surface chemical analysis. Chemical methods for the collection of elements from the surface of silicon-wafer working reference materials and their determination by total-reflection X-ray fluorescence (TXRF) spectroscopy
Edition
2005-03-31
NF C93-406-4-113 ; NF EN 61076-4-113:2005-12-01
Connectors for electronic equipment - Printed board connectors - Part 4-113 : detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
Edition
2005-12-01
BS EN 61249-5-4
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Conductive inks
Edition
1997-05-15
BS 6137
Specification for electroplated coatings of tin/lead alloys
Edition
1982-02-26
BS 1872
Specification for electroplated coatings of tin
Edition
1984-02-29