Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for interconnection structures
Edition 2011-06-07

Test methods for electrical materials, interconnections structures and assemblies Part 3: Test methods for interconnection structures (printed boards)
Edition 2012-07-04

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions - Workbench Faraday Cage method
Edition 2003-06-17

Space product assurance - Verification and approval of automatic machine wave soldering
Edition 2003-12

Detail specification : two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
Edition 2004-07-01

Surface chemical analysis. Chemical methods for the collection of elements from the surface of silicon-wafer working reference materials and their determination by total-reflection X-ray fluorescence (TXRF) spectroscopy
Edition 2005-03-31

Connectors for electronic equipment - Printed board connectors - Part 4-113 : detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
Edition 2005-12-01

Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Conductive inks
Edition 1997-05-15

Specification for electroplated coatings of tin/lead alloys
Edition 1982-02-26

Specification for electroplated coatings of tin
Edition 1984-02-29