EMC IC modelling - Part 1: General modelling framework (Endorsed by Asociación Española de Normalización in September of 2020.)
Edition 2020-09-01

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
Edition 2023-07-01

Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in July of 2004.)
Edition 2004-07-01

Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in September of 2005.)
Edition 2005-09-01

Polymeric materials - Flexible dielectric film materials for use in printed-wiring boards and flexible materials interconnect constructions
Edition 2021-03-04

Solderless connections. Press-in connections. General requirements, test methods and practical guidance
Edition 2020-09-17

IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
Edition 2017

Test methods for electrical materials, interconnections structures and assemblies Part 3: Test methods for interconnection structures (printed boards)
Edition 2012-07-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for interconnection structures
Edition 2011-06-07

Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
Edition 2010-05-31