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UNE-EN 61249-2-35
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Edition
2009-06-01
UNE-EN 61076-4-102
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications - Part 4: Printed board connectors - Section 102: Detail specification for two-part single-pole connectors, for multiple uses on plug-in units, with pre-centring, coding and early mating features, having a metric grid in accordance with IEC 60917. (Endorsed by AENOR in November of 2001.)
Edition
2001-11-01
UNE-EN 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by AENOR in July of 2008.)
Edition
2008-07-01
UNE-EN 60297-3-106
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (Endorsed by AENOR in July of 2010.)
Edition
2010-07-01
UNE-EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Endorsed by AENOR in August of 2010.)
Edition
2010-08-01
UNE-EN IEC 62433-1/AC
EMC IC modelling - Part 1: General modelling framework (Endorsed by Asociación Española de Normalización in September of 2020.)
Edition
2020-09-01
UNE-EN 61189-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)
Edition
2013-08-01
UNE-EN IEC 61249-2-51
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
Edition
2023-07-01
UNE-EN 175101-809
Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in July of 2004.)
Edition
2004-07-01
UNE-EN 175101-809 Corrigendum
Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in September of 2005.)
Edition
2005-09-01