Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (Endorsed by AENOR in March of 2016.)
Edition 2016-03-01

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (Endorsed by AENOR in January of 2006.)
Edition 2006-01-01

Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications (Endorsed by AENOR in June of 2003.)
Edition 2003-06-01

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method (Endorsed by AENOR in July of 2003.)
Edition 2003-07-01

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method (Endorsed by AENOR in April of 2006.)
Edition 2006-04-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (Endorsed by AENOR in March of 2009.)
Edition 2009-03-01

MICROPROCESSOR SYSTEM BUS. 8 BIT AND 16 BIT DATA (MULTIBUS I). PART 2: MECHANICAL AND PIN DESCRIPTIONS FOR THE SYSTEM BUS CONFIGURATION, WITH EDGE CONNECTORS (DIRECT). (Endorsed by AENOR in December of 1995.)
Edition 1995-12-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (Endorsed by AENOR in May of 2008.)
Edition 2008-05-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions of subracks and plug-in units (IEC 60297-3-104:2006 ) (Endorsed by AENOR in September of 2006.)
Edition 2006-09-01

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Edition 2009-06-01