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DIN EN IEC 61189-5-601
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021); German version EN IEC 61189-5-601:2021
Edition
2022-12
DIN EN IEC 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Edition
2018-09
DIN EN IEC 61191-1
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
Edition
2019-06
DIN EN IEC 61207-2
Expression of performance of gas analyzers - Part 2: Measuring oxygen in gas utilizing high-temperature electrochemical sensors (IEC 61207-2:2019); German version EN IEC 61207-2:2019
Edition
2021-03
DIN EN IEC 61207-3
Gas Analyzers - Expression of performance - Part 3: Paramagnetic oxygen analysers (IEC 61207-3:2019); German version EN IEC 61207-3:2019
Edition
2020-12
DIN EN IEC 61223-3-8
Evaluation and routine testing in medical imaging departments - Part 3-8: Acceptance and constancy tests - Radiography and radioscopy (IEC/CDV 61223-3-8:2022); German and English version prEN IEC 61223-3-8:2022
Edition
2023-06
DIN EN IEC 61228
Fluorescent ultraviolet lamps used for tanning - Measurement and specification method (IEC 61228:2020); German version EN IEC 61228:2020
Edition
2021-05
DIN EN IEC 61249-2-51
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023); German version EN IEC 61249-2-51:2023
Edition
2024-02
DIN EN IEC 61280-2-8
Fibre optic communication subsystem test procedures - Part 2-8: Digital systems - Determination of low BER using Q-factor measurements (IEC 61280-2-8:2021); German version EN IEC 61280-2-8:2021
Edition
2022-12
DIN EN IEC 61280-4-5
Fibre-optic communication subsystem test procedures - Part 4-5: Installed cabling plant - Attenuation measurement of MPO terminated fibre optic cabling plant using test equipment with MPO interfaces (IEC 61280-4-5:2020 + COR1:2022); German version EN IEC 61280-4-5:2020 + AC:2022
Edition
2022-12