Connectors for frequencies below 3 MHz for use with printed boards. Part 2: detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features
Edition 1999-02-01

Insulation coordination for equipment within low-voltage systems. Use of coatings to achieve insulation coordination of printed board assemblies
Edition 1995-11-15

Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method (Endorsed by Asociación Española de Normalización in June of 2021.)
Edition 2021-06-01

Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Measurement of conducted emissions. Magnetic probe method
Edition 2002-10-24

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz - 1 GHz - Part 6: measurement of conducted emissions - Magnetic probe method
Edition 2003-01-01

Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Marking legend inks
Edition 1997-03-15

Electrical relays. Specification for the basic modules for the dimensions of general purpose all-or-nothing relays
Edition 1984-05-31

Electronic components - Long-term storage of electronic semiconductor devices - Part 3: data
Edition 2020-04-17

Materials for interconnection structures. Part 8: sectional specification set for non conductive films and coatings. Section 7 : marking legend links
Edition 1997-11-01

Integrated circuits - Measurement of electromagnetic emissions - Part 4: measurement of conducted emissions - 1 omega/150 omega direct coupling method
Edition 2021-04-30