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NF C93-430-2 ; NF EN 60603-2:1999-02-01
Connectors for frequencies below 3 MHz for use with printed boards. Part 2: detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features
Edition
1999-02-01
BS 7822-3
Insulation coordination for equipment within low-voltage systems. Use of coatings to achieve insulation coordination of printed board assemblies
Edition
1995-11-15
UNE-EN IEC 61967-4
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method (Endorsed by Asociación Española de Normalización in June of 2021.)
Edition
2021-06-01
BS EN 61967-6+A1
Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Measurement of conducted emissions. Magnetic probe method
Edition
2002-10-24
NF C96-260-6 ; NF EN 61967-6:2003-01-01
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz - 1 GHz - Part 6: measurement of conducted emissions - Magnetic probe method
Edition
2003-01-01
BS EN 61249-8-7
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Marking legend inks
Edition
1997-03-15
BS 5992-6
Electrical relays. Specification for the basic modules for the dimensions of general purpose all-or-nothing relays
Edition
1984-05-31
NF C96-435-3 ; NF EN IEC 62435-3:2020-04-17
Electronic components - Long-term storage of electronic semiconductor devices - Part 3: data
Edition
2020-04-17
NF C93-747 ; NF EN 61249-8-7:1997-11-01
Materials for interconnection structures. Part 8: sectional specification set for non conductive films and coatings. Section 7 : marking legend links
Edition
1997-11-01
NF C96-260-4 ; NF EN IEC 61967-4:2021-04-30
Integrated circuits - Measurement of electromagnetic emissions - Part 4: measurement of conducted emissions - 1 omega/150 omega direct coupling method
Edition
2021-04-30