Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Edition 2017-03-31

Adhesives. Test methods for isotropic electrically conductive adhesives. Environmental test methods
Edition 2014-05-31

Adhesives - Test methods for isotropic electrically conductive adhesives - Part 7: environmental test methods
Edition 2014-12-05

Integrated circuits. Measurement of impulse immunity. Non-synchronous transient injection method
Edition 2013-10-31

Modular order for the development of mechanical structures for electronic equipment practices. Sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice. Cabinet interface dimensions for miscellaneous equipment
Edition 2012-10-31

Printed Board Assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Edition 2012-11-13

EMC IC modelling. Theory of black box modelling for conducted emission
Edition 2011-02-28

Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4
Edition 2006-01-30

Connectors for frequencies below 3 MHz for use with printed boards - Part 2: detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
Edition 2005-09-01

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
Edition 2021-05-01