Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (Endorsed by AENOR in July of 2010.)
Edition 2010-07-01

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method (Endorsed by AENOR in November of 2013.)
Edition 2013-11-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
Edition 2017-11-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
Edition 2019-12-01

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Edition 2017-10-01

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)
Edition 2017-08-01

Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
Edition 2020-06-01

Wearable electronic devices and technologies. Electronic textile. Test method for assessing washing durability of e-textile products
Edition 2023-04-25

Circuit boards and circuit board assemblies. Design and use. 3D shape data for CAD component library
Edition 2021-01-22

Environmental testing. Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Edition 2021-05-13