Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (Endorsed by AENOR in November of 2002.)
Edition 2002-11-01

Connectors for electronic equipment - Part 4-107: Printed board connectors with assessed quality - Detail specification for shielded two-part connectors having a basic grid of 2,0 mm, fixed part with solder and press-in terminations for printed boards, free part with non-accessible insulation displacement and crimp terminations (Endorsed by AENOR in March of 2002.)
Edition 2002-03-01

Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features (Endorsed by AENOR in June of 2006.)
Edition 2006-06-01

Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features. (Endorsed by AENOR in November of 2001.)
Edition 2001-11-01

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (Endorsed by AENOR in September of 2008.)
Edition 2008-09-01

Plasma display panels - Part 3-2: Interface - Electrical interface (Endorsed by AENOR in March of 2010.)
Edition 2010-03-01

Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (Endorsed by AENOR in July of 2010.)
Edition 2010-07-01

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) (Endorsed by Asociación Española de Normalización in June of 2017.)
Edition 2017-06-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
Edition 2017-11-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
Edition 2019-12-01