Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1832/CDV) (english version)
Edition 2023-03-15

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1878/CDV) (english version)
Edition 2023-10-01

BS EN 61188-6-3 Ed.1.0. Circuit boards and circuit board assemblies. Design and use. Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)
Edition 2021-01-06

BS EN IEC 62899-202-8. Printed electronics. Part 202-8. Materials. Conductive film. Measurement for difference in resistance with printing direction of conductive film fabricated with wire shaped materials
Edition 2021-12-17

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs (IEC 91/1214/CDV)
Edition 2015-01-15

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

Adhesives. Test methods for isotropic electrically conductive adhesives. Environmental test methods
Edition 2014-05-31

Adhesives - Test methods for isotropic electrically conductive adhesives - Part 7: environmental test methods
Edition 2014-12-05

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
Edition 1997-10-17

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)
Edition 2016-06-01