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IEEE 370
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
Edition
2020
IEEE 2401
IEEE Standard Format for LSI-Package-Board Interoperable Design
Edition
2019
IEEE 1149.6
IEEE Standard for Boundary-Scan Testing of Advanced Digital Networks
Edition
2015
NF C93-701 ; NF EN 61189-1:1998-08-01
Test methods for electrical materials, interconnection structures and assemblies. Part 1: general test methods and methodology
Edition
1998-08-01
BS EN 60097
Specification for grid systems for printed circuits
Edition
1993-04-15
ABNT NBR IEC 61191-4
Printed board assemblies Part 4: Sectional specification - Requirements for terminal soldered assemblies
Edition
2012-11-13
PD IEC/TR 61760-5-1
Surface mounting technology. Surface strain on circuit board. Strain gauge measurement applied to chip components
Edition
2024-02-07
BS EN 61189-1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods and methodology
Edition
1997-07-15
BS IEC 63055
Format for LSI-Package-Board Interoperable design
Edition
2023-11-08
PR NF C93-711-6-3 ; PR NF EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
