The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment (IEC 91/642/CDV)
Edition 2007-03-01

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
Edition 2000-11-17

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
Edition 2000-11-21

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
Edition 2000-12-04

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition 2021-04-01

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
Edition 2019-08-01

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 1: GENERAL TEST METHODS AND METHODOLOGY (Endorsed by AENOR in November of 1997.)
Edition 1997-11-01

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology. (Endorsed by AENOR in March of 2002.)
Edition 2002-03-01

IEEE/IEC International Standard - Format for LSI-Package-Board Interoperable design
Edition 2023

Printed electronics. Materials. Conductive ink
Edition 2023-05-25