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OEVE/OENORM EN 62468
The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment (IEC 91/642/CDV)
Edition
2007-03-01
UNE-EN 61249-3-4
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
Edition
2000-11-17
UNE-EN 61249-3-5
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
Edition
2000-11-21
UNE-EN 61249-3-3
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
Edition
2000-12-04
UNE-EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition
2021-04-01
UNE-EN IEC 61188-6-4
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
Edition
2019-08-01
UNE-EN 61189-1
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 1: GENERAL TEST METHODS AND METHODOLOGY (Endorsed by AENOR in November of 1997.)
Edition
1997-11-01
UNE-EN 61189-1/A1
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology. (Endorsed by AENOR in March of 2002.)
Edition
2002-03-01
IEEE 63055
IEEE/IEC International Standard - Format for LSI-Package-Board Interoperable design
Edition
2023
BS IEC 62899-202
Printed electronics. Materials. Conductive ink
Edition
2023-05-25