Radionuclide imaging devices - Characteristics and test conditions - Part 2: Gamma cameras for planar, wholebody, and SPECT imaging (IEC 61675-2:2015); German version EN 61675-2:2015
Edition 2021-04

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
Edition 2011-03

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
Edition 2007-02

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (IEC 60297-3-101:2004); German version EN 60297-3-101:2004
Edition 2005-06

Teleweb application - Part 1: General description (IEC 62298-1:2005); German version EN 62298-1:2005
Edition 2005-11

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
Edition 2003-12

Methods of measurement for equipment used in digital microwave radio transmission systems; part 1: measurements common to terrestrial radio-relay systems and satellite earth stations; section 2: basic characteristics (IEC 60835-1-2:1992); German version EN 60835-1-2:1993
Edition 1993-12

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements; flatness considerations for electronic assemblies (IEC 61188-1-1:1997); German version EN 61188-1-1:1997
Edition 1998-03

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006
Edition 2007-01

Calibration of fibre-optic power meters (IEC 61315:2019); German version EN IEC 61315:2019
Edition 2020-07