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DIN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
Edition
2011-09
DIN EN 61196-3
Radio frequency cables - Part 3: Sectional specification for coaxial cables for local area networks (IEC 61196-3:1998); German version EN 61196-3:1998
Edition
1999-05
DIN EN 60191-6-18
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
Edition
2010-08
DIN EN 62071-1
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape - Format D-7 - Part 1: VTR specifications (IEC 62071-1:2005); German version EN 62071-1:2006
Edition
2006-10
DIN 2310-6
Thermal cutting - Part 6: Classification, processes
Edition
2023-03
DIN EN 4500-001
Aerospace series - Metallic materials - Rules for drafting and presentation of material standards - Part 001: General rules; German version ASD-STAN prEN 4500-001:2023
Edition
2024-01
DIN EN 60191-4
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition
2019-02
DIN EN 62298-2
Teleweb application - Part 2: Delivery methods (IEC 62298-2:2005); German version EN 62298-2:2005
Edition
2005-11
DIN EN IEC 63093-4
Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 4: RM-cores (IEC 63093-4:2019); German version EN IEC 63093-4:2019
Edition
2019-11
DIN EN 61189-5-4
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
Edition
2015-11