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Standards [CURRENT]

DIN EN 60191-6-17

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
Edition 2011-09

Standards [CURRENT]

DIN EN 61196-3

Radio frequency cables - Part 3: Sectional specification for coaxial cables for local area networks (IEC 61196-3:1998); German version EN 61196-3:1998
Edition 1999-05

Standards [CURRENT]

DIN EN 60191-6-18

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
Edition 2010-08

Standards [CURRENT]

DIN EN 62071-1

Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape - Format D-7 - Part 1: VTR specifications (IEC 62071-1:2005); German version EN 62071-1:2006
Edition 2006-10

Standards [CURRENT]

DIN 2310-6

Thermal cutting - Part 6: Classification, processes
Edition 2023-03

Draft standard

DIN EN 4500-001

Aerospace series - Metallic materials - Rules for drafting and presentation of material standards - Part 001: General rules; German version ASD-STAN prEN 4500-001:2023
Edition 2024-01

Standards [CURRENT]

DIN EN 60191-4

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

Standards [CURRENT]

DIN EN 62298-2

Teleweb application - Part 2: Delivery methods (IEC 62298-2:2005); German version EN 62298-2:2005
Edition 2005-11

Standards [CURRENT]

DIN EN IEC 63093-4

Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 4: RM-cores (IEC 63093-4:2019); German version EN IEC 63093-4:2019
Edition 2019-11

Standards [CURRENT]

DIN EN 61189-5-4

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
Edition 2015-11

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