Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (Endorsed by AENOR in June of 2013.)
Edition 2013-06-01

Printed boards and printed board assemblies - Design and use - Attachments (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Edition 2008-05-30

Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Seismic tests for cabinets and racks
Edition 2011-11-30

Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297 series. Combination of performance levels for modular cabinets
Edition 2012-11-30

Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Discrete components
Edition 2003-10-16

Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components
Edition 2004-04-01

Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides
Edition 2016-07-29

Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Edition 2016-07-15

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105 : dimensions and design aspects for 1U high chassis
Edition 2009-02-01

Mechanical structures for electronic equipment - Tests for CEI 60917 and CEI 60297 - Part 2: seismic tests for cabinets and racks
Edition 2014-11-15