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DIN IEC 60807-1
Rectangular connectors for frequencies below 3 MHz; part 1: generic specification; general requirements; identical with IEC 60807-1:1991
Edition
1993-04
DIN EN 60603-1
Connectors for frequencies below 3 MHz for use with printed boards - Part 1: Generic specification: General requirements and guide for the preparation of detail specifications, with assessed quality (IEC 60603-1:1991 + A1:1992); German version EN 60603-1:1998
Edition
1998-07
DIN EN 60107-2
Methods of measurement on receivers for television broadcast transmissions - Part 2: Audio channels - General methods and methods for monophonic channels (IEC 60107-2:1997); German version EN 60107-2:1997
Edition
1997-12
DIN EN 61076-4-105
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 105: Detail specification for 9 mm circular connector with 3 to 8 contacts for use in a wide range of applications including the telecommunication and audio industry (IEC 61076-4-105:1995); German version EN 61076-4-105:1998
Edition
1999-02
DIN EN 60603-13
Connectors for frequencies below 3 MHz for use with printed boards - Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displacement terminations (ID) (IEC 60603-13:1995); German version EN 60603-13:1998
Edition
1998-09
DIN EN 50090-6-3
Home and Building Electronic Systems (HBES) - Part 6-3: 3rd Party HBES IoT API; German version EN 50090-6-3:2023
Edition
2024-08
DIN EN IEC 62828-4
Reference conditions and procedures for testing industrial and process measurement transmitters - Part 4: Specific procedures for level transmitters (IEC 62828-4:2020); German version EN IEC 62828-4:2020
Edition
2022-07
DIN EN 61076-4-101
Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality; Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917 (IEC 61076-4-101:2001); German version EN 61076-4-101:2001
Edition
2002-09
DIN EN IEC 63287-1
Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (IEC 63287-1:2021); German version EN IEC 63287-1:2021
Edition
2023-09
DIN EN 61746-2
Calibration of optical time-domain reflectometers (OTDR) - Part 2: OTDR for multimode fibres (IEC 61746-2:2010); German version EN 61746-2:2011
Edition
2011-09