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Flexible insulating sleeving - Part 2: Methods of test

Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 281: Heat-shrinkable, polyolefin sleeving, semiconductive

Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 282: Heat-shrinkable, polyolefin sleeving - Stress control

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809 : X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods

Fibre optic communication subsystem test procedures - Part 2-13 : digital systems - Measurement of error vector magnitude

Optical fibres - Part 1-22: Measurement methods and test procedures - Length measurement

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