TP-71C SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
Edition 2008-05

Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipment R(1997)
Edition 1991-10

Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050") Spacing) Chip Carriers for Use in Electronic Equipment R(1998)
Edition 1990-08

Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for time to delamination. T260, T288, T300
Edition 2023-08-30

Calibration of wavelength/optical frequency measurement instruments. Michelson interferometer single wavelength meters
Edition 2011-07-31

Soft soldering - Part 5: Registration and analysis of defects on printed board assemblies (IEC 91/182/CDV)
Edition 2000-03-01

Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test
Edition 2004-12-31

Printed electronics. Materials. Resistance measurement method for thermoformable conducting layer
Edition 2023-08-23

BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures. Part 3-6. Sectional specification set for unreinforced base materials, clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Edition 2024-04-05