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UNE-EN 61249-4-17
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
Edition
2009-12-01
BS EN 61754-20-100
Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Interface standard for LC connectors with protective housings related to IEC 61076-3-106
Edition
2012-09-30
BS EN 62417
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Edition
2010-06-30
BS 9525 N0001
Detail specification for multi-contact two-part printed board electrical connectors
Edition
1982-02-15
24/30488910 DC
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Edition
2024-03-08
UNE-EN 16602-70-12
Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
Edition
2016-11-01
NEMA ICS 4
Application Guideline for Terminal Blocks
Edition
2015
EIA-364-71C
TP-71C SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
Edition
2008-05
EIA-540AA00
Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipment R(1997)
Edition
1991-10
EIA-540AAAA
Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050") Spacing) Chip Carriers for Use in Electronic Equipment R(1998)
Edition
1990-08