Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
Edition 2009-12-01

Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Interface standard for LC connectors with protective housings related to IEC 61076-3-106
Edition 2012-09-30

Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Edition 2010-06-30

Detail specification for multi-contact two-part printed board electrical connectors
Edition 1982-02-15

BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Edition 2024-03-08

Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
Edition 2016-11-01

Application Guideline for Terminal Blocks
Edition 2015

TP-71C SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
Edition 2008-05

Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipment R(1997)
Edition 1991-10

Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050") Spacing) Chip Carriers for Use in Electronic Equipment R(1998)
Edition 1990-08