Detail Specification for 2 Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes
Edition 2002-11

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)
Edition 2024-01-01

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Edition 2006-01-01

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
Edition 2013-05-01

Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Edition 2021-03-25

Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Edition 1996-04-15

Printed electronics. Materials. Conductive ink. Printed patterns for mechanical test
Edition 2023-10-26

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Edition 2006-01-01

Composite string insulator units for overhead lines with a nominal voltage greater than 1000 V. Dimensional and electrical characteristics
Edition 1999-02-15

Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Edition 1994-02-15