Test methods for electrical materials, interconnections structures and assemblies Part 5: Test methods for printed board assemblies
Edition 2012-04-25

Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Edition 2014-10-31

Device embedding assembly technology - Part 1: generic specification for device embedded substrates
Edition 2019-12-06

Device embedded substrate - Part 1-1 : generic specification - Test methods
Edition 2015-10-16

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (Endorsed by Asociación Española de Normalización in July of 2024.)
Edition 2024-07-01

Electronic components. Inspection of printed boards for microwave applications
Edition 1995-09-01

Achievement of industrial process measurement and control equipment for electrical production and distribution installations. Electronic components and electronic modules
Edition 1997-03-01

Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements
Edition 2004-07-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
Edition 2021-06-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition 2021-04-01