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DIN EN ISO 52018-1
Energy performance of buildings - Indicators for partial EPB requirements related to thermal energy balance and fabric features - Part 1: Overview of options (ISO 52018-1:2017); German version EN ISO 52018-1:2017
Edition
2020-10
DIN EN 61834-2
Recording - Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) - Part 2: SD format for 525-60 and 625-50 systems (IEC 61834-2:1998); German version EN 61834-2:1998
Edition
1999-04
DIN EN 62071-2
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape - Format D-7 - Part 2: Compression format (IEC 62071-2:2005); German version EN 62071-2:2006
Edition
2006-10
DIN EN 61834-1
Recording - Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) - Part 1: General specifications (IEC 61834-1:1998 + A1:2001); German version EN 61834-1:1998 + A1:2001
Edition
2002-02
DIN EN 61834-6
Recording - Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) - Part 6: SDL format (IEC 61834-6:2000); German version EN 61834-6:2000
Edition
2001-07
DIN EN 62326-1
Printed boards - Part 1: Generic specification (IEC 62326-1:2002); German version EN 62326-1:2002
Edition
2002-12
DIN EN 61146-1
Methods of measurement for video cameras (PAL/SECAM/NTSC) - Part 1: Non-broadcast single-sensor cameras (IEC 61146-1:1994); German version EN 61146-1:1996
Edition
1997-04
DIN EN 60706-5
Maintainability of equipment - Part 5: Testability and diagnostic testing (IEC 60706-5:2007); German version EN 60706-5:2007
Edition
2008-03
DIN EN 62149-1
Fibre optic active components and devices - Performance standards - Part 1: General and guidance (IEC 62149-1:2011); German version EN 62149-1:2012
Edition
2012-09
DIN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
Edition
2011-09