Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1800/CDV) (english version)
Edition 2022-09-15

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1755/CDV) (english version)
Edition 2021-12-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)
Edition 2022-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition 2021-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)
Edition 2016-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
Edition 2016-05-01

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (Endorsed by AENOR in March of 2008.)
Edition 2008-03-01

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
Edition 2004-01-01

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (Endorsed by AENOR in July of 2008.)
Edition 2008-07-01

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006). (Endorsed by AENOR in January of 2007.)
Edition 2007-01-01