Search results
Search list
Results in:
UNE-EN 61189-2-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
Edition
2016-11-01
UNE-EN 62496-4
Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)
Edition
2011-07-01
UNE-EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
Edition
2021-11-01
NF C93-930-2-5 ; NF EN IEC 62496-2-5:2023-01-20
Optical circuit boards - Basic test and measurement procedures - Part 2-5 : flexibility test for flexible opto-electric circuits
Edition
2023-01-20
NF C93-430-3 ; NF EN 60603-3:1998-06-01
Connectors for frequencies below 3 MHz for use with printed boards. Part 3: two-part connectors for printed boards, having contacts spaced at 2,54 mm (0,1 in) centres and staggered terminations at that same spacing
Edition
1998-06-01
BS EN 60603-3
Connectors for frequencies below 3 MHz for use with printed boards. Two-part connectors for printed boards having contacts spaced at 2,54 mm (0,100 in) centres and staggered terminations at that same spacing
Edition
1998-11-15
BS EN 123300
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Edition
1989-08-31
BS EN 123500-800
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Edition
1991-12-20
UNE-EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)
Edition
2024-07-01
UNE-EN 61249-2-41
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)
Edition
2010-09-01