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Standards [CURRENT]

UNE-EN 61189-2-719

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
Edition 2016-11-01

Standards [CURRENT]

UNE-EN 62496-4

Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)
Edition 2011-07-01

Standards [CURRENT]

UNE-EN IEC 61189-2-807

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
Edition 2021-11-01

Optical circuit boards - Basic test and measurement procedures - Part 2-5 : flexibility test for flexible opto-electric circuits
Edition 2023-01-20

Connectors for frequencies below 3 MHz for use with printed boards. Part 3: two-part connectors for printed boards, having contacts spaced at 2,54 mm (0,1 in) centres and staggered terminations at that same spacing
Edition 1998-06-01

Standards [CURRENT]

BS EN 60603-3

Connectors for frequencies below 3 MHz for use with printed boards. Two-part connectors for printed boards having contacts spaced at 2,54 mm (0,100 in) centres and staggered terminations at that same spacing
Edition 1998-11-15

Standards [CURRENT]

BS EN 123300

Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Edition 1989-08-31

Standards [CURRENT]

BS EN 123500-800

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Edition 1991-12-20

Standards [New]

UNE-EN IEC 61189-2-808

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)
Edition 2024-07-01

Standards [CURRENT]

UNE-EN 61249-2-41

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)
Edition 2010-09-01

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