Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 91/1833/CDV) (english version)
Edition 2023-03-15

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1761/CDV) (english version)
Edition 2021-12-15

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)
Edition 2023-10-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Española de Normalización in November of 2023.)
Edition 2023-11-01

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 3:TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 2,54 MM (0,100 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING.
Edition 1999-07-28

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)
Edition 2018-11-01

Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits (Endorsed by Asociación Española de Normalización in March of 2023.)
Edition 2023-03-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
Edition 2016-11-01

Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)
Edition 2011-07-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
Edition 2021-11-01