Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of 2003.)
Edition 2003-07-01

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)
Edition 2010-09-01

Device embedding assembly technology - Part 2-602 : guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Edition 2021-08-13

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ. ULTRA-MINIATURE BOARD-MOUNTED PRINTED-WIRING CONNECTORS HAVING A STAGGERED CONTACT SPACING OF 1,27 MM (O,05 IN)
Edition 1982-10-15

Electronic components. Connecting devices. Multicontact board mounted connectors for printed boards with 2,54 mm spacing. Type he 11. Book 1
Edition 1986-07-01

Electronic components. Specification for interconnection multiwire printed boards
Edition 1994-02-01

Electronic components. Connecting devices. Multicontact edge socket and board mounted connectors for double clad printed boards with 2,54 mm spacing. Type HE 9. Detail requirements
Edition 1977-02-14

 
Edition 1980-04-01

 
Edition 1984-03-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method