Electronic components. Printed wiring. Rework of printed boards
Edition 1979-12-01

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
Edition 1999-03-24

Printed boards - Part 1: Generic specification
Edition 2004-02-27

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006). (Endorsed by AENOR in January of 2007.)
Edition 2007-01-01

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
Edition 2019-12-01

Device embedding assembly technology. Guidelines. Implementation of a 3D data format for device embedded substrate
Edition 2019-11-18

Device embedded substrate. Guidelines. Electrical testing
Edition 2015-12-31

Printed boards Part 4: Rigid multilayer printed boards with interlayer conections - Sectional specification
Edition 2007-03-26

Printed boardsSart1: Generic specification
Edition 2007-03-26

 
Edition 2007-04-09