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UTE C93-723U ; UTE C93-723:1979-12-01
Electronic components. Printed wiring. Rework of printed boards
Edition
1979-12-01
UNE-EN 62326-4-1
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
Edition
1999-03-24
UNE-EN 62326-1
Printed boards - Part 1: Generic specification
Edition
2004-02-27
UNE-EN 61189-2
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006). (Endorsed by AENOR in January of 2007.)
Edition
2007-01-01
UNE-EN IEC 62878-2-5
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
Edition
2019-12-01
BS EN IEC 62878-2-5
Device embedding assembly technology. Guidelines. Implementation of a 3D data format for device embedded substrate
Edition
2019-11-18
PD IEC/TR 62878-2-2
Device embedded substrate. Guidelines. Electrical testing
Edition
2015-12-31
ABNT NBR IEC 62326-4 Versão Corrigida
Printed boards Part 4: Rigid multilayer printed boards with interlayer conections - Sectional specification
Edition
2007-03-26
ABNT NBR IEC 62326-1
Printed boardsSart1: Generic specification
Edition
2007-03-26
ABNT NBR IEC 62326-4 Errata 1
Edition
2007-04-09